发明名称 Method of forming a power module with a magnetic device having a conductive clip
摘要 A method of forming a power module located on a conductive substrate by providing power conversion circuitry. The method of providing the power conversion circuitry includes forming a magnetic device by placing a magnetic core proximate a conductive substrate with a surface thereof facing a conductive substrate, and placing a conductive clip proximate a surface of the magnetic core. The method of forming the magnetic device also includes electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core. The method of providing the power conversion circuitry also includes providing at least one switch on the conductive substrate. The method of forming the power module also includes depositing an encapsulant about the power conversion circuitry.
申请公布号 US8701272(B2) 申请公布日期 2014.04.22
申请号 US20050243787 申请日期 2005.10.05
申请人 LOTFI ASHRAF W.;WILKOWSKI MATHEW A.;LIAKOPOULOS TRIFON M.;WELD JOHN D.;ENPIRION, INC. 发明人 LOTFI ASHRAF W.;WILKOWSKI MATHEW A.;LIAKOPOULOS TRIFON M.;WELD JOHN D.
分类号 H01F27/30;H01L23/495 主分类号 H01F27/30
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