| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board and a manufacturing method of the same, which can ensure connection reliability of a bump while increasing a concentration of a conductor pattern in the outermost layer.SOLUTION: A printed wiring board comprises: an interlayer insulation layer 50F; a conductor pattern 58FP formed on the interlayer insulation layer 50F; and a solder resist layer having an opening for exposing at least a part of the conductor pattern 58FP and the interlayer insulation film located around the conductor pattern 58FP. The printed wiring board further comprises: a metal layer formed on the conductor pattern and the interlayer insulation layer which are exposed from the opening; and a bump arranged on the metal layer in the opening. |
