发明名称 POLISHING APPARATUS
摘要 PROBLEM TO BE SOLVED: To suppress variations in torque fluctuation detection of an electric motor.SOLUTION: A polishing apparatus includes: a first electric motor 14 which rotationally drives a turn table 12; and a second electric motor 22 rotationally driving a top ring 20 which, together with the turn table 12, can hold a workpiece (for example, a semiconductor wafer 18). The turn table 12 and the top ring 20 are rotated while the workpiece is sandwiched therebetween, so that the workpiece is polished and a surface of the workpiece is planarized. At least one of the first electric motor and the second electric motor includes a winding of a plurality of phases. The polishing device further includes: U-phase, V-phase current detecting parts 202, 204 which detect current of at least two phases of the plurality of phases; a three-phase/two-phase converter 220 which generates a composite current based on the detected current; and an endpoint detection device 230 which detects torque fluctuation of the electric motor caused by polishing.
申请公布号 JP2014069256(A) 申请公布日期 2014.04.21
申请号 JP20120215592 申请日期 2012.09.28
申请人 EBARA CORP 发明人 SHINOZAKI HIROYUKI
分类号 B24B37/013;H01L21/304 主分类号 B24B37/013
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