发明名称 LAMINATED STRUCTURE BODY, THIN-FILM TRANSISTOR ARRAY, AND METHOD OF MANUFACTURING THEM
摘要 PROBLEM TO BE SOLVED: To provide a laminated structure body that resolves the connection instability between a first electrode and a second electrode and surely connects the first electrode and the second electrode, a thin-film transistor array, and a method of manufacturing them.SOLUTION: A laminated structure body includes: a first electrode layer on an insulating substrate; a first insulating film on the first electrode layer; a second electrode layer on the first insulating film; a second insulating film on the second electrode layer; and a third electrode layer on the second insulating film. The laminated structure body has a portion connecting the first electrode layer and the second electrode layer, and the portion has a laminated structure of the first electrode layer, an opening of the first insulating film, the second electrode layer, an opening of the second insulating film, and the third electrode layer. In the opening of the second insulating film, the third electrode layer relays and reinforces the connection between the first electrode layer and the second electrode layer on the first insulating film.
申请公布号 JP2014067883(A) 申请公布日期 2014.04.17
申请号 JP20120212531 申请日期 2012.09.26
申请人 TOPPAN PRINTING CO LTD 发明人 ISHIZAKI MAMORU;HATTA KAORU
分类号 H01L21/768;G09F9/30;H01L21/822;H01L23/522;H01L27/04;H01L29/786 主分类号 H01L21/768
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