ELECTRONIC MODULE, ELECTRONIC MODULE DEVICE AND METHOD OF MANUFACTURE

摘要

This invention particularly relates to an electronic module 1 comprising a dielectric support film 3 with, on one of its sides, a metallised electrical contact zone 5 made up of a plurality of contact surfaces C1 to C8 that are electrically insulated from each other by means of insulation paths 13, wherein said contact surfaces C1 to C8 are designed to come in contact with an electronic reader. On the side opposite that with the electrical contact zone 5, the dielectric support film 3 comprises a microchip 7 connected to said contact surfaces C1 to C8. The side of the dielectric support film 3 with the electrical contact zone 5 comprises at least one portion 15 where the dielectric support film 3 is bared to define an area for personalised graphics 17.