| 摘要 |
In an illustrative embodiment, a plurality of integrated circuits are stacked one on top of the other in a block. A plurality of leads on each integrated circuit is made accessible on a first side of the block. An insulating layer is formed on the first side of the block; electrically conducting vias are formed in the insulating layer and coupled to the leads; a conducting layer is formed on the insulating layer and coupled to the conducting vias; and conducting paths are formed in the conducting layer. Additional layers of insulating layer, conducting vias and conducting layer may be formed on top of the first insulating layer and first conducting layer so as to form more complicated interconnection paths to the leads from the integrated circuits. |
