发明名称 |
HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING |
摘要 |
A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s). |
申请公布号 |
US2014096387(A1) |
申请公布日期 |
2014.04.10 |
申请号 |
US201314105716 |
申请日期 |
2013.12.13 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CAMPBELL LEVI A.;CHU RICHARD C.;DAVID MILNES P.;ELLSWORTH, JR. MICHAEL J.;IYENGAR MADHUSUDAN K.;SIMONS ROBERT E. |
分类号 |
B23P15/26 |
主分类号 |
B23P15/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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