| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition having slightly-changed heat resistance after being subjected to a thermal history and exhibiting low thermal expandability in a cured product, a cured product thereof, a printed wiring board having slightly-changed heat resistance after being subjected to a thermal history and excellent low thermal expandability, and a phenolic hydroxyl group-containing resin giving these performances.SOLUTION: There is provided a polycondensate of para-phenylphenol, a &bgr;-naphthol compound and formaldehyde, where the polycondensate contains a trifunctional compound (X) represented by the structure formula (1) [Rand Reach independently represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms and an alkoxy group having 1 to 4 carbon atoms] and the content of the trifunctional compound (X) is 50% or more by an area ratio in GPC measurement. |
