发明名称 METHOD FOR MANUFACTURING IMAGE SENSOR IC
摘要 Provided is an image sensor IC in which a conductive material transmissive to light, which is fixed to the same potential, is formed under a protection film in a plurality of pixel regions. The conductive material transmissive to light for potential fixation is formed in each pixel, has a narrow and linear shape, and is electrically connected so as to hold the same potential as a potential of a silicon substrate. Accordingly, a potential of each of the regions which become a base at the time of forming the protective film is kept constant in an entire pixel region, thereby obtaining a uniform thickness and quality of the protective film. As a result, variation in photoelectric conversion characteristic of the pixels can be eliminated.
申请公布号 KR101383944(B1) 申请公布日期 2014.04.10
申请号 KR20070134251 申请日期 2007.12.20
申请人 发明人
分类号 H01L27/14;H01L27/146;H01L31/10;H04N1/028;H04N5/335;H04N5/369;H04N5/374;H04N5/3745 主分类号 H01L27/14
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