发明名称 HARDMASK
摘要 PROBLEM TO BE SOLVED: To provide new hardmask compositions for an electronic device substrate that can be used to form a hardmask film with a high cross-link density and with excellent solvent resistance.SOLUTION: A composition is selected from: (i) an oligomer comprising metal-containing pendant groups represented by the formula (1); (ii) an oligomer represented by the formula (2); and their mixture. The composition provides a metal oxide hardmask having a range of etch selectivity. Also provided are methods of depositing metal oxide hardmasks using the compositions.
申请公布号 JP2014062253(A) 申请公布日期 2014.04.10
申请号 JP20130196367 申请日期 2013.09.24
申请人 ROHM & HAAS ELECTRONIC MATERIALS LLC 发明人 WANG DEYAN;SUN JIBIN;CHUANG PENG-WEI;PETER TREFONAS III;LIU KONG
分类号 C08F2/00;C08F20/06;C08G79/00;H01L21/027 主分类号 C08F2/00
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