发明名称 |
Semiconductor package structure and manufacturing method thereof |
摘要 |
A method of manufacturing a semiconductor package structure is provided. A heat-conductive block is adhered to a portion of a second surface of a conductive substrate via a first adhesive layer. An opening is formed by performing a half-etching process on a first surface of the conductive substrate. The remaining conductive substrate is patterned to form leads and expose a portion of the heat-conductive block. Each lead has a first portion and a second portion. A thickness of the first portion is greater than a thickness of the second portion. A first lower surface of the first portion and a second lower surface of the second portion are coplanar. A chip is disposed on the exposed portion of the heat-conductive block and electrically connected to the second portions of the leads. A first bottom surface of the heat-conductive block and a second bottom surface of a molding compound are coplanar. |
申请公布号 |
US8691630(B2) |
申请公布日期 |
2014.04.08 |
申请号 |
US201213647406 |
申请日期 |
2012.10.09 |
申请人 |
CHIPMOS TECHNOLOGIES INC. |
发明人 |
PAN YU-TANG;CHOU SHIH-WEN |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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