发明名称 HEAT CONDUCTING DEVICE, COOLING APPARATUS, AND MAGNETIC RESONANCE SYSTEM
摘要 <p>The present invention provides a heat conducting device (110), a cooling apparatus, and a magnetic resonance system. The heat conducting device includes a flexible component (102) and a first rigid component (101), and one end of the flexible component is connected to the first rigid component by a stamping method. According to the technical solution of the present invention, the heat conducting device is manufactured by a stamping method, a simple process and excellent heat conductivity are achieved, and the cost can be saved with the same effect.</p>
申请公布号 WO2014048984(A1) 申请公布日期 2014.04.03
申请号 WO2013EP69959 申请日期 2013.09.25
申请人 SIEMENS PLC 发明人 FANG, ZHI CHUN;YANG, LEI
分类号 G01R33/38;G01R33/3815;H01F6/04;H01R4/00 主分类号 G01R33/38
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