发明名称 |
Dielectrophoretic Cooling Solution for Electronics |
摘要 |
At least one cooling channel is positioned adjacent to an electronic component. The cooling channel communicates with plenums at each of two opposed axial ends. A dielectric fluid is received in the cooling channel. The cooling channel is provided with at least one electrode. A potential is applied to the at least one electrode such that an electric field magnitude at the downstream end of the channel is less than an upstream electric field magnitude, and such that a dielectrophoretic force on a bubble in the cooling channel will force it downstream. |
申请公布号 |
US2014092551(A1) |
申请公布日期 |
2014.04.03 |
申请号 |
US201213633167 |
申请日期 |
2012.10.02 |
申请人 |
HAMILTON SUNDSTRAND CORPORATION |
发明人 |
PEARSON MATTHEW ROBERT;ST. ROCK BRIAN |
分类号 |
H05K7/20;G06F1/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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