CHIP COMPONENT AND PRODUCTION METHOD THEREFOR

摘要

Provided is a chip component comprising: a substrate having a front surface and side surfaces; an electrode that is integrally formed on the front surface and the side surfaces so as to cover the edge section of the front surface of the substrate; and an insulating film that is interposed between the electrode and the substrate. A circuit assembly according to the present invention comprises the chip component and a mounting substrate having a land that is soldered to the electrode on a mounting surface that is opposite the front surface of the substrate.