| 摘要 |
PROBLEM TO BE SOLVED: To suppress decline of yield caused by rejoining of a movable part and a regulation part, in a method for manufacturing a semiconductor device including a joining step for joining a different member to a movable structure having the movable part and the regulation part for regulating a movable range of the movable part.SOLUTION: In a movable structure comprising wafers 11, 21, regulation parts 13, 23 are not exposed and a part of movable parts 12, 22 is exposed as a view from the upside of a joining surface with a different member 31 (figure 2 (8)). In order that surfaces of the regulation parts 13, 23 are not modified, a joining surface of the wafer 21 and the different member 31 is subjected to surface modification to form a surface-modified part 27 (figure 2 (9)). The wafer 21 and the different member 31 are subjected to surface activation joining (figure 2 (10)). |
