发明名称 PLASMA DOPING APPARATUS, PLASMA DOPING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 Disclosed is a plasma doping apparatus including a processing chamber, a substrate holding unit, a plasma generating mechanism, a pressure control mechanism, a bias power supply mechanism, and a control unit. The control unit controls the pressure within the processing chamber to be a first pressure and controls the bias power to be supplied to the holding unit is to be a first bias power for a first plasma process. The control unit also controls the pressure within the processing chamber to be a second pressure which is higher than the first pressure, and controls the bias power to be supplied to the holding unit to be a second bias power which is lower than the first bias power for a second plasma process.
申请公布号 US2014094024(A1) 申请公布日期 2014.04.03
申请号 US201314039761 申请日期 2013.09.27
申请人 TOKYO ELECTRON LIMITED 发明人 OKA MASAHIRO;KOBAYASHI YUUKI;UEDA HIROKAZU;HORIGOME MASAHIRO
分类号 H01L21/22;H01L21/67 主分类号 H01L21/22
代理机构 代理人
主权项
地址