| 摘要 |
PROBLEM TO BE SOLVED: To diffuse heat in an electronic apparatus having a resin plate.SOLUTION: A resin plate 26 is provided with a heat transfer body 54 capable of transferring heat from one side 26A to the other side 26B in the plate thickness direction. Heat of an electronic component 38 provided on the side of the one side 26A of the resin plate 26 is transferred to the other side 26B through the heat transfer body 54. |
