Overlay circuit structure for interconnecting semiconductor light emitting devices and method of manufacturing the same

摘要

A system and method for packaging light emitting semiconductors (LESs) is disclosed. An LES device (10) is provided that includes a heatsink (14) and an array of LES chips (12) mounted on the heatsink (14) and electrically connected thereto, with each LES chip comprising connection pads (28) and a light emitting area (32) configured to emit light therefrom responsive to a received electrical power. The LES device (10) also includes a flexible interconnect structure (18) positioned on and electrically connected to each LES chip to provide for controlled operation of the array of LES chips (12), with the flexible interconnect structure (18) further including a flexible dielectric film (24) configured to conform to a shape of the heatsink (14) and a metal interconnect structure (22) formed on the flexible dielectric film (24) and that extends through vias (26) formed in the flexible dielectric film (24) so as to be electrically connected to the connection pads (28) of the LES chips (12).