发明名称 Light emitting device and light emitting device package
摘要 Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device (LED) comprises an LED chip (200), a barrier (310) over the LED chip, and an encapsulating material containing a phosphor (400), wherein the encapsulating material is disposed inside the barrier over the LED chip.
申请公布号 EP2315281(B1) 申请公布日期 2014.04.02
申请号 EP20100187826 申请日期 2010.10.15
申请人 LG INNOTEK CO., LTD. 发明人 HWANG, JUNG HA;JO, KYOUNG WOO
分类号 H01L33/54 主分类号 H01L33/54
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