MICROELECTRONIC PACKAGES HAVING TRENCH VIAS AND METHODS FOR MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a microelectronic package including at least one trench via with hollow parts, and a method for fabricating such a microelectronic package.SOLUTION: In one embodiment, the method includes the step of depositing a dielectric layer over a first microelectronic device having a plurality of contact pads, which are covered by the dielectric layer. A trench via is formed in the dielectric layer to expose the plurality of contact pads therethrough. The trench via is formed to include opposing crenulated sidewalls having a plurality of hollow parts therein. The plurality of contact pads exposed through the trench via are then sputter etched. A plurality of interconnect lines are formed over the dielectric layer, each of which is electrically coupled to a different one of the plurality of contact pads.