RESIN COMPOSITION FOR PACKAGE SUBSTRATE, AND PACKAGE SUBSTRATE COMPRISING CORE LAYER AND PREPREG USING THE SAME

摘要

The present invention relates to an insulating composition for a package substrate, which contains a polyester amide based liquid crystal oligomer, a bisphenol based tetra functional epoxy resin, a hardener and an inorganic filler, wherein the bisphenol based tetra functional epoxy resin has a viscosity of greater than 20,000 cps; and the package substrate comprising a core insulating layer and insulating pre-preg using the same. A resin composition for the package substrate, according to the present invention, can provide the package substrate with a reduced curving by improving the heat radiation properties of a substrate material. The resin composition also reduces the interformational separation between a chip and a substrate and the generation of solder ball cracks with the reduced substrate curving, thereby reducing a failure of the substrate. [Reference numerals] (AA) Amide group; (BB) Ester group