发明名称 |
LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHODS FOR MANUFACTURING LIGHT EMITTING DEVICE, RESIN PACKAGE AND RESIN-MOLDED BODY |
摘要 |
A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part. |
申请公布号 |
US2014084320(A1) |
申请公布日期 |
2014.03.27 |
申请号 |
US201313969182 |
申请日期 |
2013.08.16 |
申请人 |
NICHIA CORPORATION |
发明人 |
ICHIKAWA HIROFUMI;HAYASHI MASAKI;SASAOKA SHIMPEI;MIKI TOMOHIDE |
分类号 |
H01L33/62;H01L33/60 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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