PACKAGE CIRCUIT, AND METHOD OF PACKAGING INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a package for a circuit board having components generating much heat.SOLUTION: The package circuit according to one embodiment of the present invention includes: a lead frame including a first section including a chip mounting area and a first protruded portion, and a second section; an integrated circuit chip which is attached to the chip mounting area and thermally contacts the chip mounting area; and a sealing material layer having a top surface, a bottom surface, and a side surface. The first protruded portion is provided for an area closer to the second section than the chip mounting area, and bent so as to form a first heat path which transmits heat from the chip mounting area to the bottom surface penetrating the sealing material layer without passing through the side surface. A part of the second section extends through the side surface, the first heat path has thermal resistance smaller than that of the heat path passing through the second section, and a part of the first section extends from the chip mounting area to a direction opposite to the first protruded portion.