发明名称 PROCESSING NOZZLE FOR PROCESSING SUBSTRATE
摘要 Disclosed is an invention relating to a supply nozzle for a processing substrate. The supply nozzle for a processing substrate includes a nozzle body which has a receiving space for receiving a process solution for processing a substrate, a heat radiation part which is separated and fixed to the nozzle body part, a transfer body part which is reciprocally moved and combined between the nozzle body and the heat radiation part, and a reciprocating part which make the transfer body part reciprocate. When a process solution is supplied to the supply nozzle for processing a substrate, the surface tension of the process solution which is stored in the supply nozzle can be increased.
申请公布号 KR101377657(B1) 申请公布日期 2014.03.25
申请号 KR20130030845 申请日期 2013.03.22
申请人 KOREA TECHNO CO., LTD. 发明人 SONG, NAC HYUN;LEE, SANG CHON
分类号 H01L21/66 主分类号 H01L21/66
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