发明名称 CHIP EDGE SEALING
摘要 The invention relates to a semiconductor component comprising a semiconductor body, an insulation on the semiconductor body and a cell array arranged at least partly within the semiconductor body. The cell array has at least one p-n junction and at least one contact connection. The insulation is bounded in lateral direction of the semiconductor body by a circumferential diffusion barrier.
申请公布号 US2014077262(A1) 申请公布日期 2014.03.20
申请号 US201314032437 申请日期 2013.09.20
申请人 INFINEON TECHNOLOGIES AG 发明人 ZUNDEL MARKUS;BRASE GABRIELA;NELLE PETER;SCHINDLER GUENTHER
分类号 H01L29/739 主分类号 H01L29/739
代理机构 代理人
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