| 摘要 |
PROBLEM TO BE SOLVED: To prevent peeling of a bonding layer.SOLUTION: In one embodiment example, a plasma etching device comprises: a base formed of a metal indicating an expansion coefficient lower than aluminum; an electrostatic chuck which is disposed on a mounting surface of the base and in which a workpiece is mounted; a bonding layer which bonds the base and the electrostatic chuck; and a heater provided in the electrostatic chuck. In one embodiment example, the base in the plasma etching device also includes a metal part formed by cold spraying using a metal having higher thermal conductivity than a metal which forms the base. |
