| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal film deposition apparatus and deposition method in which a metal film of uniform film quality can be applied over a substrate stably.SOLUTION: A metal film deposition method comprises steps of locating a solid electrolyte membrane 13 between an anode 11 and a cathode 12, contacting the solid electrolyte membrane 13 with a substrate B, making the cathode 12 conductive with the substrate B, and applying voltage between the anode 11 and the cathode 12, resulting in film deposition of a metal film F. When a metal ion solution L is located between the anode 11 and the solid electrolyte membrane 13, and the solid electrolyte membrane 13 is contacted with the substrate B, then, the solution L being pressed, a fluid pressure of the metal ion solution L presses the substrate B through the solid electrolyte membrane 13, resulting in film deposition. |
