INFRARED RAYS SENSOR REAR SURFACE POLISHING METHOD

摘要

In an infrared ray sensor rear surface polishing and a polishing method for the same, a wire bonding pad (3) having a read-out integrated circuit (2) is combined with a detection array element (1). When one surface of the detection array element (1) is polished at a thickness where quantum efficiency (QE) is optimized, polishing is performed in a state where the four sides of the detection array element (1) and the read-out integrated circuit (2) are surrounded by a dummy wafer (20). During rear surface polishing, materials polished in the detection array element (1) are induced to discharge to the dummy wafer placed around the detection array element (1) in order to prevent the occurrence of a ball type defect. In addition, the damage to the wire bonding pad (3) of the read-out integrated circuit (2) due to an injected chemical substance can be prevented by using the dummy wafer (20). [Reference numerals] (AA) Start; (S10) Polishing preparing process; (S100) polishing setting process; (S110) Prepare a polishing jig; (S120) Fixate an infrared ray sensor polishing module to the polishing jig; (S130) Is the fixating state good?; (S21) Detection array element; (S22) Signal obtaining circuit; (S23) Glass disc; (S24) Dummy wafer; (S30) Combine an infrared ray sensor; (S40) Attach the glass disc and inject wax; (S50) Attach the signal obtaining circuit dummy wafer; (S51) Does it agree with the thickness of the signal obtaining circuit?; (S60) Attach the detection array element dummy wafer; (S61) Is it a horizontal state with the detection array element?; (S62) Is a wire bonding pad covered with the detection array element dummy wafer?; (S70) Complete the infrared ray sensor polishing module