发明名称 Verfahren zum Verbinden eines Bauteils mit einem Träger über eine Lötung und Bauteil zum Verbinden mit einem Träger
摘要 <p>A method for connecting a component to a support via soldering between a first contact surface of the component and a second contact surface of the support. The method is distinguished by features including that at least one spacer is embodied in such a manner and arranged between the first contact surface and the second contact surface that the first contact surface and the second contact surface are spaced from one another, and that the soldering is executed in such a manner that the component and the support are connected with one another via the first contact surface and the second contact surface. Also claimed is a component connectable with a support via soldering is intended.</p>
申请公布号 DE102012105297(A8) 申请公布日期 2014.03.20
申请号 DE201210105297 申请日期 2012.06.19
申请人 ENDRESS + HAUSER GMBH + CO. KG 发明人 BIRGEL, DIETMAR;ROSBERG, ANDREAS;SCHMIDT, ELKE
分类号 H05K3/34;H05K3/30 主分类号 H05K3/34
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