| 摘要 |
The present invention relates to a metal mask grown in a plating method. The characteristic of the present invention is to determine the size of a micro hole on a metal mask in a plating method by considering not only a temperature difference between actual work where the metal mask is used and the plating method where the metal mask is manufactured but also a thermal expansion coefficient of the metal mask. The metal mask manufactured by considering thermal expansion comprises as follows: a sensitive material coating process which evenly coats a sensitive material on an electric conductor substrate; a light exposing process which makes the sensitive material be exposed to light by radiating light on a film composed of a transparent unit and an opaque unit; a space unit forming process which forms a space unit by chemically removing a light unexposed unit; a metal mask plating process which forms a metal mask by performing coating on the space unit through the application of electricity on the electric conductor substrate in a plating tank; a light exposed unit removing process which chemically removes the light exposed unit; and a separating process which separates the metal mask from the electric conductor substrate. After the metal mask plating process, a polishing process can be included in order to smoothly polish the surface of the metal mask. In the light exposing process for making the sensitive material be exposed to light, the light exposed unit can be tapered. In addition, prior to the metal mask plating process, a frame can be installed in order to perform plating on the metal mask and at the same time to integrate the frame with the metal mask. A releasing agent coating process for coating a releasing agent on the electric conductor substrate can be included in order to facilitate releasing work. |
