| 摘要 |
PROBLEM TO BE SOLVED: To supply a lead frame for optical semiconductor device, exhibiting excellent mass productivity, and having a high reflectance while enhancing adhesion to sealing resin, inexpensively, and to supply an optical semiconductor device having a high luminous efficiency and a high reliability by using this lead frame.SOLUTION: A lead frame for optical semiconductor device, on which an LED element is mounted, includes a body having a mounting surface on which the LED element is mounted, and a silver reflection layer provided as a reflection layer, containing silver or a silver alloy, on the mounting surface side of the body. The maximum cross-sectional height Rt of a roughness curve of the silver reflection layer is 0.24-0.70, and the root-mean-square gradient Rdq of the roughness curve is 0.03-0.08. |
