SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE USED THEREFOR AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor element mounting substrate which enables a solder appropriate for wire bonding to be formed in a wire bonding part, and enables a solder having good solder bondability to be optionally selected and formed in an intended region of the external connection terminal part on a rear face side after making the external connection terminal part independent by performing etching after resin encapsulation.SOLUTION: A semiconductor element mounting substrate comprises: a columnar part 4 formed by processing a metal plate 10 by half etching to form a recess on a surface side; noble metal plating 3 for wire bonding formed on a top face of the columnar part; and a resist mask 2 which has a shape required for an external connection terminal part and is formed on a rear face side of the metal plate at a part which finally requires plating as the external connection terminal part.