| 摘要 |
A manufacturing method for an LED package, having a varistor substrate with an outer electrode pattern formed by printing without a plating process, is disclosed. According to the present invention, the manufacturing method for an LED package having a varistor substrate comprises the steps of: forming a varistor substrate which forms a varistor layer having multiple inner electrode layers inside thereof; forming an electrode layer by printing a conductive paste, which includes Ag on the varistor substrate; sintering the electrode layer; and mounting a light emitting device on the electrode layer. [Reference numerals] (S10) Form a varistor substrate; (S20) Sinter the varistor substrate; (S30) Process the surface of the varistor substrate; (S40) Print an electrode pattern; (S50) Sinter an electrode layer; (S60) Selectively polish the surface of an electrode; (S70) Mount a light emitting element |
