| 摘要 |
<p>PURPOSE: A polyamide molding composition is provided to be reliably welded without blisters, especially at temperatures of 260°C or higher and after absorbing moisture. CONSTITUTION: A polyamide molding composition comprises 62-87 weight% of copolyamide, which is partially aromatic and partially crystalline, 5-15 weight% of an ionomer, 8-18 weight% of a flame retardant, and 0-5 weight% of an additive. The copolyamide is manufactured by diacid fraction and diamine fraction. The diacid fraction comprises 50-100 weight% terephthalic acid and/or naphthalenedicarboxylic acid with amelting point of 270-320°C, and 0-50 weight% of isophthalic acid. The diamine fraction comprises one or more diamines selected from the group consisting of butanediamine, pentanediamine, hexanediamine, octanediamine, methyloctane diamine, nonanediamine, decanediamine, undecanediamine, and dodecanediamine.</p> |
