发明名称 LED MODULE AND METHOD FOR MANUFACTURING THE SAME
摘要 Disclosed are an LED module and a method for manufacturing the same. According to one side of the present invention, the LED module includes a PCB, an LED chip mounted to directly touch the PCB and electrically connected to the circuit pattern of the PCB, and a heat radiation member emitting the heat of the PCB and the LED and connected to an opposite surface where the LED chip of the PCB is mounted.
申请公布号 KR101375271(B1) 申请公布日期 2014.03.17
申请号 KR20120055382 申请日期 2012.05.24
申请人 发明人
分类号 F21V17/00;F21V29/00 主分类号 F21V17/00
代理机构 代理人
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