| 摘要 |
PROBLEM TO BE SOLVED: To enable required electrical stress to be applied to an electrode layer forming a wiring pattern.SOLUTION: In a semiconductor chip 1, a first wiring layer 4, a testing conductor layer 6, and a second wiring layer 8 are formed on a semiconductor substrate 2 each via an insulating film. The testing conductor layer 6 is formed on almost the whole surface so as to cover a region where the first wiring layer 4 and the second wiring layer 8 are opposed to each other. The testing conductor layer 6 is connected to an electrode E3, and has such a configuration that the testing conductor layer 6 and the electrode E3 can be set to the same potential. Thereby, by applying voltage stress between the testing conductor layer 6 and the first wiring layer 4 or the second wiring layer 8 at inspection, failures can be determined when a foreign matter 12 or the like exists, and a screening test can be performed with certainty. |
