半导体封装,申请号TW096149867-传众专利搜索

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发明名称	半导体封装
摘要
申请公布号	TWI430408	申请公布日期	2014.03.11
申请号	TW096149867	申请日期	2007.12.25
申请人	新光电气工业股份有限公司日本	发明人	织田卓哉
分类号	H01L23/34;H04N5/74	主分类号	H01L23/34
代理机构		代理人	赖经臣台北市松山区南京东路3段346号11楼;宿希成台北市松山区南京东路3段346号11楼
主权项
地址	日本

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