发明名称 SUBSTRATE OVERLAYING DEVICE, SUBSTRATE HOLDING DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate overlaying device that is easy to manufacture and handle, and precisely overlays substrates.SOLUTION: The substrate overlaying device includes: a first substrate holding unit which holds a first substrate having a first index for positioning on an upper surface on a first substrate holding surface, and has a light transparent part at a position where at least the first index is observed from the opposite surface side of the first substrate holding surface; a second substrate holding unit which holds a second substrate having a second index for positioning on an upper surface on a second substrate holding surface; an index observation unit for optically observing at least the first index through the light transparent part with observation light from the opposite direction of the first substrate holding surface; and a position adjusting unit which adjusts relative positions of the first substrate and second substrate according to the position of the first index observed by the index observation unit.
申请公布号 JP2014042055(A) 申请公布日期 2014.03.06
申请号 JP20130217594 申请日期 2013.10.18
申请人 NIKON CORP 发明人 MAEDA HIDEHIRO
分类号 H01L21/02 主分类号 H01L21/02
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