MODULAR COOLING SYSTEM

摘要

According to the present disclosure, a modular cooling system (10) for cooling a plurality of electronic components (20) is provided. The cooling system comprises a plurality of cooling modules (30) and a clamping arrangement (40). Each cooling module (30) comprises an evaporator unit, a condenser, a first pipe system (70) and a second pipe system (80). The clamping arrangement (40) is adapted for holding and pressing an alternation stack (90) in which the evaporator units (50) are stacked in alternation with the power electronic components (20).