发明名称 |
EPOXY RESIN COMPOSITION, PREPREG, LAMINATE BOARD, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE, INSULATING RESIN SHEET, AND PROCESS FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD |
摘要 |
DISCLOSED IS AN EPOXY RESIN COMPOSITION ESSENTIALLY CONTAINING (A) AN EPOXY RESIN HAVING A STRUCTURE REPRESENTED BY THE GENERAL FORMULA (1) BELOW, (B) A CURING AGENT, (C) AN INORGANIC FILLER, AND (D) A CYANATE RESIN AND/OR A PREPOLYMER THEREOF. (IN THE FORMULA, AR REPRESENTS A FUSED-RING AROMATIC HYDROCARBON GROUP; R REPRESENTS AN INTEGER NOT LESS THAN 1; X REPRESENTS A HYDROGEN OR AN EPOXY GROUP (A GLYCIDYL ETHER GROUP); R1 REPRESENTS ONE GROUP SELECTED FROM THE GROUP CONSISTING OF A HYDROGEN, A METHYL GROUP, AN ETHYL GROUP, A PROPYL GROUP, A BUTYL GROUP, A PHENYL GROUP AND A BENZYL GROUP; N REPRESENTS AN INTEGER NOT LESS THAN 1; AND P AND Q EACH REPRESENTS AN INTEGER NOT LESS THAN 1, AND P ? S AND Q ? S IN RESPECTIVE REPEATING UNITS MAY BE THE SAME AS OR DIFFERENT FROM ONE ANOTHER.) (FIG.3) |
申请公布号 |
MY150705(A) |
申请公布日期 |
2014.02.28 |
申请号 |
MY2009PI04242 |
申请日期 |
2008.04.09 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
ENDO, TADASUKE;TAKAHASHI, AKIHITO |
分类号 |
C08G59/20 |
主分类号 |
C08G59/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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