CLAMP FOR REDUCING BENDING IN PACKAGE AND METHOD THEREFOR

摘要

The present invention provides a clamp for reducing bending in a package and a method therefor, belonging to the technical field of integrated circuit chip packaging. The clamp comprises an upper pressing plate and a lower pressing plate, wherein in the cooling process of the packaging, the package is placed between the upper pressing plate and the lower pressing plate and is clamped down by the upper pressing plate and the lower pressing plate to reduce bending of the package. The clamp significantly improves the package bending, the method is simple, and efficiency is high.