| 摘要 |
An apparatus and method for inspecting whether marking of a target chip in a wafer has been performed normally are provided. The apparatus includes a voltage application detector which detects application of a voltage to an external circuit, an image pickup unit which captures an image, and a controller which controls the image pickup unit to capture an image at at least one predetermined point when the application of the voltage is detected by the voltage application detector and determines whether the marking of the target chip has been performed normally based on the captured image. Accordingly, extra time is not required to inspect whether the marking of the target chip in the wafer has been performed normally and the inspection is performed without using a prober operation program. |
