| 摘要 |
The present invention relates to applications of a substrate slicing process in fabrications of electronics, optoelectronics and microelectromechanical systems (MEMS) devices, particularly two-sided devices. The methods proposed in the present invention are applicable to various crystalline silicon solar cell manufacturing schemes. This invention also relates to an apparatus of slicing a thin substrate into two pieces by a laser irradiation on the side wall. The apparatus can comprise two opposite-facing substrate chucks with a substrate moves through the opening in between. The present invention is further directed to methods and apparatus of separating a continuous thin layer of materials from side wall of a rotating ingot by a laser irradiation. A film can be deposited on/bonded to the ingot side wall prior to the separation of the thin film layers. |
