| 摘要 |
PROBLEM TO BE SOLVED: To achieve various types of processing for a substrate without being affected by distortion of thermal expansion by suppressing the distortion of thermal expansion by disturbance of a temperature distribution at a contact portion occurring while the substrate is being conveyed.SOLUTION: The minienvironment includes: an apparatus for opening and closing a transportation case storing a plurality of substrates; a transfer robot that transfers the substrates; a sensor that measures a temperature of the substrate; and control means that controls a temperature of a hand section of the transfer robot for holding the substrate to reach the temperature of the substrate measured by the sensor. |
