| 摘要 |
The present invention provides a thin film deposition apparatus and a thin film deposition method. The thin film deposition apparatus comprises: a vacuum chamber; a first induction coil which is inside the vacuum chamber; a levitation material which is arranged in the center area of the first induction coil; a first alternating current power source for evaporating the levitation material by inductively heating and levitating the levitation material by providing an alternating current power for the first induction coil; a second induction coil which is arranged by being separated from the first induction coil perpendicularly; a substrate structure, which is arranged in the center area of the second induction coil, and which includes a substrate; and a second alternating current power source for heating the substrate structure by proving an alternating current power for the second induction coil. Vapor, which is evaporated from the levitation material, reaches the substrate, and forms a thin film. |
