发明名称 ALUMINUM ALLOY MATERIAL FOR USE IN THERMAL CONDUCTION APPLICATION
摘要 An aluminum alloy material for use in thermal conduction to which improved castability has been imparted by silicon addition. It has improved thermal conductivity and improved strength. The material has a composition containing 7.5-12.5 mass % Si and 0.1-2.0 mass % Cu, the remainder being Al and unavoidable impurities, wherein the amount of copper in the state of a solid solution in the matrix phase is regulated to 0.3 mass % or smaller. The composition may further contain at least 0.3 mass % Fe and/or at least 0.1 mass % Mg, provided that the sum of (Fe content) and (content of Mg among the impurities)×2 is 1.0 mass % or smaller and the sum of (Cu content), (content of Mg among the impurities)×2.5, and (content of Zn among the impurities) is 2.0 mass % or smaller.
申请公布号 US2014048186(A1) 申请公布日期 2014.02.20
申请号 US201314057296 申请日期 2013.10.18
申请人 NIPPON LIGHT METAL COMPANY, LTD. 发明人 HORIKAWA HIROSHI;SHIODA MASAHIKO
分类号 C22F1/043 主分类号 C22F1/043
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