发明名称 ADHERING DEVICE, ADHERING SYSTEM, AND ADHERING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an adhering device capable of improving adhesion accuracy when an adhesion member is adhered to a substrate.SOLUTION: The adhering device comprises: a chamber C; a member holding mechanism provided in the chamber C and holding the adhesion member; a chamber transfer mechanism 18 for moving the chamber C; and a mechanism for vacuum exhausting inside of the chamber and supplying low-molecule gas in the chamber C. The adhering device adheres the adhesion member held by the member holding mechanism to a substrate S held by a substrate holding mechanism in the chamber C inside of which is vacuum exhausted, or in the chamber C to inside of which the low molecule gas is supplied.
申请公布号 JP2014033141(A) 申请公布日期 2014.02.20
申请号 JP20120174049 申请日期 2012.08.06
申请人 TOKYO ELECTRON LTD 发明人 TOMEZUKA KOJI
分类号 H01L21/683;G11B5/84;G11B5/855;G11B7/26;H01L21/027 主分类号 H01L21/683
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