发明名称 |
ADHERING DEVICE, ADHERING SYSTEM, AND ADHERING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide an adhering device capable of improving adhesion accuracy when an adhesion member is adhered to a substrate.SOLUTION: The adhering device comprises: a chamber C; a member holding mechanism provided in the chamber C and holding the adhesion member; a chamber transfer mechanism 18 for moving the chamber C; and a mechanism for vacuum exhausting inside of the chamber and supplying low-molecule gas in the chamber C. The adhering device adheres the adhesion member held by the member holding mechanism to a substrate S held by a substrate holding mechanism in the chamber C inside of which is vacuum exhausted, or in the chamber C to inside of which the low molecule gas is supplied. |
申请公布号 |
JP2014033141(A) |
申请公布日期 |
2014.02.20 |
申请号 |
JP20120174049 |
申请日期 |
2012.08.06 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
TOMEZUKA KOJI |
分类号 |
H01L21/683;G11B5/84;G11B5/855;G11B7/26;H01L21/027 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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