MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board for a PoP (Package on Package) on which a semiconductor element is easily mounted.SOLUTION: A manufacturing method of a printed circuit board comprises: a step of forming a step opening at a first surface processing area side where a circuit layer 120 of a first surface processing area is exposed by applying an exposure and development step to a first opening of the first surface processing area side; a step of forming a first surface processing layer 150 on the exposed circuit layer 120 of the first surface processing area; a step of forming a second opening 134 at a second surface processing area side by applying laser processing to a first opening 132 at a second surface processing area side to expose a circuit layer 120 of the second surface processing area; and a step of forming a second surface processing layer 160 on the exposed circuit layer 120 of the second surface processing area. A solder resist layer 130 is formed in a stepped shape corresponding to the step opening at the first surface processing area side.