发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method, a substrate processing method and a substrate processing apparatus which can form an insulation film of good quality in a low temperature region.SOLUTION: A semiconductor device manufacturing method comprises: a process of forming a thin film having a predetermined composition and a predetermined film thickness on a substrate by performing a cycle predetermined times, which includes a process of supplying a first silane-based material having a halogen-based ligand to the substrate, a process of supplying a second silane-based material having an amino group to the substrate and a process of supplying a reaction gas different from each material to the substrate.
申请公布号 JP2014030041(A) 申请公布日期 2014.02.13
申请号 JP20130194992 申请日期 2013.09.20
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 HIROSE YOSHIRO;KANAYAMA KENJI;MIZUNO KANEKAZU;TAKAZAWA HIROMASA;OTA YOSUKE
分类号 H01L21/318;C23C16/42;H01L21/31;H01L21/316 主分类号 H01L21/318
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