发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method, a substrate processing method and a substrate processing apparatus which can form an insulation film of good quality in a low temperature region.SOLUTION: A semiconductor device manufacturing method comprises: a process of forming a thin film having a predetermined composition and a predetermined film thickness on a substrate by performing a cycle predetermined times, which includes a process of supplying a first silane-based material having a halogen-based ligand to the substrate, a process of supplying a second silane-based material having an amino group to the substrate and a process of supplying a reaction gas different from each material to the substrate. |
申请公布号 |
JP2014030041(A) |
申请公布日期 |
2014.02.13 |
申请号 |
JP20130194992 |
申请日期 |
2013.09.20 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
HIROSE YOSHIRO;KANAYAMA KENJI;MIZUNO KANEKAZU;TAKAZAWA HIROMASA;OTA YOSUKE |
分类号 |
H01L21/318;C23C16/42;H01L21/31;H01L21/316 |
主分类号 |
H01L21/318 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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