| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder alloy and a solder paste containing the solder alloy which have a reduced silver content, reduce costs, secure excellent wettability, and suppress generation of voids (air gaps), and to provide an electronic circuit substrate obtained by using the solder paste.SOLUTION: A tin-silver-copper-based solder alloy contains tin, silver, antimony, bismuth, copper and nickel, wherein germanium is not substantially contained. Based on the total amount of the solder alloy, a silver content ratio is more than 1.0 mass% and less than 1.2 mass%, an antimony content ratio is 0.01 mass%-10 mass%, and a bismuth content ratio is 0.01 mass%-3.0 mass%. |
